+Material Testing
? DIC technology is applicable to any material
? DIC software analyzes Young's modulus, Poisson's ratio, N value, and R value
? Mechanical testing (tension, compression, bending, torsion, shear)
? Fatigue and creep testing
? CTE testing and semiconductor device warpage
+Real-time measurement and analysis of parts
? Performance testing
? Quality assessment
? Guiding the assembly process
+Multi-media environmental measurement
3D DIC system has strong environmental adaptability and can measure high and low temperature, underwater, mirror and vacuum environments.
+Multi-head stereo measurement
The multi-camera DIC measurement system uses multiple sets of measuring heads, which are calibrated in a unified coordinate or aligned in advance, and aligned frame by frame; by unifying the coordinates in three-dimensional space, stereo or ultra-large range measurement can be achieved.
+Simulation results verification
? Complex problem discovery
? Simulation parameter tuning
? Manufacturing process optimization